Silicon Chip Visual Inspection System: both sides in one pass, directly on blue tape
A 25 MP industrial camera at 1.5 μm/pixel detects defects above 3 μm. Available in monochrome and color, with no die removal or flipping.
The Silicon Chip Visual Inspection System is Shin Shou's complete machine for die appearance inspection. Dies stay on the blue tape while an X/Y/Z/θ four-axis motorized stage positions them, so front and back are scanned in a single pass.
Key specifications
- One 25 MP industrial camera each for front and back, 1.5 μm/pixel resolution
- Detects defects > 3 μm, including micro-cracks, chipping, die rotation and color deviation
- Die sizes 6 mil to 150 mil; 195 × 195 mm scan range on 10-inch wafer frames
- Robotic loading and unloading, dual cassette stations, 7 frames per cassette
Three-source lighting
Coaxial light shows the overall outline, while high- and low-angle side lighting brings out edge cracks and chipped corners in relief, reducing escapes.
Monochrome or color?
For geometric defects and micro-cracks, the monochrome model gives the highest contrast. If your acceptance criteria include color deviation, oxidation or contamination, we recommend the color model.
Send us die samples. We run an imaging test first, then recommend the right model.
