Shin Shou Optical Automation

Every die carries
our seal of promise

Built on optical imaging and machine vision, with optional AI algorithm modules: custom AOI inspection automation for semiconductor, optoelectronics, life-science and traditional manufacturers.

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Silicon Chip Visual Inspection System
Featured Machine

Silicon Chip Visual Inspection System

1.5 μm resolution, front and back inspected in one pass, dies inspected directly on blue tape. Production record: 3 units on repeat orders, 2 of them in volume production for over two years.

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Every flaw seen. Every promise sealed.
Our Promise

Every flaw seen.
Every promise sealed.

A seal is a contract and a commitment. Every machine we ship carries Shin Shou's mark.

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Who we serve
  • Science park manufacturers
  • Semiconductor assembly & test
  • Optoelectronic components
  • Medical & life-science manufacturing
  • Traditional industry upgrades
About Shin Shou

About Shin Shou

Bringing together seasoned experts from semiconductor and equipment manufacturers, we turn complex electromechanical and vision challenges into intelligent equipment that safeguards production-line yield

Founded in Hsinchu, Taiwan in 2020, Shin Shou Optical Automation develops AOI visual inspection machines and machine vision inspection equipment, integrating optical imaging, mechanics, electrical control and software. Our engineers come from semiconductor fabs and equipment makers, with hands-on experience building test equipment and automating optoelectronics production.

We handle everything from requirements and sample imaging tests to mechanical design, software and on-site acceptance, replacing manual visual inspection with automated optical inspection and helping customers adopt Industry 4.0 smart manufacturing for inspection steps that still rely on the human eye.

Founded
2020Hsinchu, Taiwan
Background
Semiconductor fabs & equipment makers
Inspection solutions
Semiconductor · Optoelectronics · Life science · Traditional
Capabilities
Optics · Mechanics · Electronics · SoftwareAll done in-house
Core Technologies

Core Technologies

Deep Learning

AI defect detection (optional)

An optional AI algorithm toolkit trains defect classification and PPE recognition models on real production images, cutting false calls (overkill) and manual re-inspection.

Vision Module

Vision inspection modules

Industrial camera, lens and multi-angle lighting design for area-scan and line-scan imaging, stable from micron-scale dies and transparent parts to reflective metal.

Custom Machine

Custom machines

Loading, transfer, AOI and downstream actions integrated into one machine, designed around your line's takt time, with 100% in-line inspection and immediate rejection of defects.

Custom Software

Custom software

Operator interfaces, statistical reports, mapping, barcode traceability and MES/ERP integration built around how your team works.

Automated, digitalized productionFour capabilities combined into one traceable line
Why Shin Shou

Why Shin Shou

01

Talk directly to the engineers

One engineering team owns your project from the imaging test to final acceptance, so requirements are never lost in hand-offs.

02

Truly custom

Mechanics, optics and software are all built in-house, so the machine is adapted to your line takt and the way your operators work — not a standard machine forced onto your line.

03

Prove it first, then build

We image your samples first to confirm the defects can be captured and detected, before any machine design. The imaging test is free.

Customer types we have served
  • LED die makers
  • Probe card makers
  • Life-science consumables makers
  • Passive component makers
Industries & Cases

Industries and track record

Probe inspection, image-based counting and needle bending: complete machines that combine AOI with downstream actions for test houses and probe-card makers, from cassette loading to statistical reports.

Automatic Probe Bender

Automatic Probe Bender

From straight probe to finished bend — one machine, one flow.

Probes are critical consumables in wafer test: a fraction of a degree in bending angle or a few microns at the tip affects the yield of an entire probe card. Shin Shou integrates incoming inspection, measurement and bending in one machine. Straight probes are loaded in a cassette, transferred automatically, measured by AOI and bent to the set parameters — with an image record for every probe.

  • Cassette transfer, AOI inspection and bending modules in one machine — less handling, less waiting
  • Three dedicated cameras for length, bend positioning and tip inspection, down to 0.73 μm resolution
  • Bending angle set by parameters; straight and bent probes are inspected before and after
Key specs
Materials
W, ReW, BeCu, Pb
Probe diameter
70–250 μm
Bending angle
100°–105°
Tip diameter
12–18 μm
  • AOI
  • Integrated transfer
  • Bending module
Probe Counter

Probe Counter

Counts you can trust — with reports and permissions built in.

Probes are tiny and come in large numbers; counting them by hand is slow and hard to verify. Shin Shou replaces manual counting with image-based counting, and designs the operator screens and statistical reports around each customer's workflow. Login, counting, zoom review and report export all live in one interface, so managers always know the quantity of every lot.

  • Automatic image-based counting replaces counting probe by probe
  • Operator screens and report formats customised to the user
  • Operator login and permission levels, with traceable records
Key specs
Counting
image recognition
Reports
custom statistics
Access
operator login levels
  • Image counting
  • Custom reports
  • Permissions
LED & Si Chip Visual Inspection System

LED & Si Chip Visual Inspection System

Dies stay on blue tape. Front and back, seen in full.

Every flip or transfer of a die is a new chance of damage. Shin Shou's inspection system works directly on blue tape and inspects both front and back, with in-house inspection software and Mapping output. A pre-scan calculates the inspection area, then pattern alignment images every die — so even 6 mil dies are not missed.

  • Inspects directly on blue tape, front and back
  • Pre-scan area calculation plus optical pattern alignment
  • In-house inspection software with wafer Mapping output
Key specs
Die size
6–150 mil
Wafer frame
10" (243 mm ID)
Inspection area
195 × 195 mm
Resolution
1.5 μm/px
  • 1.5 μm/px
  • Double-sided
  • Mapping
  • Micro-crack detection
Ceramic Substrate Visual & Laser-Marking OCR System

Ceramic Substrate Visual & Laser-Marking OCR System

Mark, read and inspect — all in one machine.

On ceramic substrates, marking quality decides downstream traceability. Shin Shou combines 532 nm green-laser marking, OCR and visual inspection: after optical pattern alignment the machine marks an 18-character alphanumeric code, reads it back and verifies it immediately, so every piece is marked correctly and readable — at 400 pieces per hour.

  • 532 nm green-laser marking, character height from 0.2 mm
  • Optical pattern alignment with ±20 μm fixture accuracy
  • OCR verification and visual inspection right after marking
Key specs
Substrate
50×60 / 60×70 mm
Code
18 alphanumeric characters
Character height
0.2–0.6 mm
Throughput
400 pcs/hr
  • OCR
  • Laser marking
  • Visual inspection
Laser-Marking OCR Inspection System

Laser-Marking OCR Inspection System

Marks that never fade. Codes that are never misread.

Labels peel and ink fades, but a laser mark lasts. Shin Shou marks product IDs with fast, high-precision lasers, then reads every character with OCR software to confirm the print, model and lot number — and can interlock with your systems. Every ID links back to its production record, so process issues can be traced.

  • Precise, high-power laser marking that will not peel or fade
  • OCR reads text, model and lot numbers and can drive system interlocks
  • Product IDs link to production records for root-cause analysis
Key specs
Marking
high-precision laser
Reading
OCR verification
Industries
semiconductor, opto, life science, food, general
  • Laser marking
  • OCR
  • Traceability
Contact Lens Inspection System

Contact Lens Inspection System

A product worn on the eye has no room for a 21 μm flaw.

Contact lenses are nearly transparent, so bubbles and edge tears are very hard to judge consistently by eye. Shin Shou images each lens with a 4096 × 3000 camera and completes inspection in 300 ms on average, detecting defects down to 21 μm. The system was validated on 500 images of good and defective samples, moved and rotated.

  • Detects bubbles, edge tears, burrs, scratches and foreign matter
  • Minimum defect 21 μm, about 300 ms per lens
  • Validated with 500 sample images at multiple positions
Key specs
Camera
4096 × 3000
Pixel size
6.9 μm
Minimum defect
21 μm
Cycle time
300 ms/lens
  • Bubbles
  • Edge tears
  • Scratches
  • Transparent parts
Cell Counter

Cell Counter

No staining, no damage — let the cells count themselves.

Conventional cell counting often requires staining or destroying the sample, costing time and consumables. Shin Shou takes a different approach: an in-house imaging method combined with software logic counts cells non-destructively and without staining agents, so samples remain available for further use.

  • Non-destructive — samples remain usable afterwards
  • No staining agents, saving consumables and preparation time
  • In-house algorithms count cells automatically from images
Key specs
Method
non-destructive imaging
Reagents
no staining required
Core
in-house algorithms
  • Non-destructive
  • Stain-free
  • Algorithms
AI Deep-Learning PPE Compliance Module

AI Deep-Learning PPE Compliance Module

Before anyone enters the line, AI checks every piece of protective gear.

Safety audits that rely on people watching will always miss something. Shin Shou trains deep-learning models to recognise helmets, rain suits, gloves and other PPE, and judges in real time whether a person is fully equipped — an automatic checkpoint for gates and line entrances, so safety rules no longer depend on self-discipline alone.

  • Deep learning recognises helmets, rain suits, gloves and other PPE
  • Real-time judgement on people actually wearing the gear
  • Can be trained for additional PPE items on request
Key specs
Technology
AI deep learning
Judgement
real-time vision
Use
line entrances, access gates
  • AI deep learning
  • Workplace safety
  • Real-time
MLCC Visual & Packaging Inspection System

MLCC Visual & Packaging Inspection System

Inspect first, then pack: every part passes Shin Shou before it goes into the tape.

MLCCs are tiny, ship in huge volumes and usually leave the factory on tape and reel — once a defective part is packed, only the customer will find it. Shin Shou images every part before packaging, using high- and low-angle side lighting to reveal the body and terminations, and only passes good parts on to taping. One machine handles sizes from 01005 to 1210.

  • Every part inspected before packaging; rejects removed before taping
  • High- and low-angle side lighting reveals body damage and terminal defects
  • Shared tooling for 01005–1210 for fast changeovers
Key specs
Sizes
01005–1210
Camera
640×480 CCD
Lens
0.7X–4.5X
Lighting
high / low-angle side light
  • 01005–1210
  • Pre-packaging inspection
  • Visual inspection
Metal Parts Visual Inspection

Metal Parts Visual Inspection

Defects one light cannot show are revealed by several.

Metal surfaces are highly reflective, and under a single light source scratches and dents are often hidden by glare. Shin Shou captures the same part several times under different lighting, producing different imaging effects that are judged together — so defects that were hard to detect consistently stand out clearly, improving detection and reducing manual re-inspection.

  • Sequential multi-light capture gives several images of each part
  • Combined judgement improves detection of scratches and dents
  • Lighting combinations tuned to material and defect type
Key specs
Imaging
multi-light, multi-shot
Targets
stamped and machined metal parts
Focus
defects on reflective surfaces
  • Multi-light imaging
  • Metal parts
  • Reflective-surface defects
Cosmetics Visual Inspection System

Cosmetics Visual Inspection System

Brand image starts with the details of every pack.

The first thing a customer sees is the packaging and its print. Shin Shou designs a different imaging method for each product: cylindrical containers are line-scanned to unroll the whole outer surface, while cartons are checked for fonts and appearance — replacing most manual inspection with one consistent standard.

  • Imaging tailored to each product; cylinders unrolled by line scan
  • Checks carton fonts, print quality and cosmetic defects
  • One consistent standard replaces most manual inspection
Key specs
Imaging
area scan + line scan
Targets
cylindrical containers, cartons
Checks
print, fonts, appearance
  • Visual inspection
  • Line scan
  • Print inspection
Featured Machine

Featured machine

Silicon Chip Visual Inspection System
AOI Inspection · BW / Color

Silicon Chip
Visual Inspection System

Die AOI inspection: front and back inspected in one pass, with dies left on the blue tape. Available with monochrome or color cameras to match your defect types.

2 units running on customer production lines for over two years

1.5μm/px25 MP industrial camera
>3μmMinimum detectable defect
2sidesFront and back in one pass
195×195 mmScan range on 10-inch wafer frames
Request the full spec sheet→

Inspect directly on blue tape

No die removal or flipping. An X/Y/Z/θ four-axis stage positions each die and covers both sides in one pass.

Three-source lighting

Coaxial light plus high- and low-angle side lighting brings out micro-cracks, chipping and corner defects in relief.

AI classification and traceability

Offline review with built-in AI classification; barcode-driven recipes, mapping files and archived NG images.

Articles & News

Insights and news

Why Shin Shou's logo is a seal
Company news2026.10.16

Why Shin Shou's logo is a seal

In Chinese culture, stamping a seal means entering a contract and taking responsibility. We built that meaning into our brand: every machine we ship is a promise bearing our mark.

Multi-light imaging: making scratches and dents on metal parts visible
Tech notes2026.10.13

Multi-light imaging: making scratches and dents on metal parts visible

Metal surfaces reflect strongly, and a single light often hides defects in the glare. We capture several images under different lighting angles and combine them into an image that is easier to judge.

Silicon Chip Visual Inspection System: both sides in one pass, directly on blue tape
Semiconductor2026.10.09

Silicon Chip Visual Inspection System: both sides in one pass, directly on blue tape

A 25 MP industrial camera at 1.5 μm/pixel detects defects above 3 μm. Available in monochrome and color, with no die removal or flipping.

Tech note: camera resolution and field of view — choose right without overspending or slowing the line
Tech notes2026.10.06

Tech note: camera resolution and field of view — choose right without overspending or slowing the line

Detection capability is roughly 3–5 times the resolution; doubling resolution means four times the images. A table of fields of view for 5 MP to 25 MP cameras at different resolutions, plus trade-offs from real projects.

Tech note: assembly checks and large parts — solder joints, nuts and washers, coil insulation
Tech notes2026.09.24

Tech note: assembly checks and large parts — solder joints, nuts and washers, coil insulation

Missing, broken and unsoldered joints all show up in images; the hard part is component leads with varying shapes. Nuts, screw torque marks and part numbers on control panels can be recognised. Large coils need rotation and lifting mechanics first.

Inspecting Si dies on blue tape: the five hardest problems and the results we delivered
Semiconductor2026.07.28

Inspecting Si dies on blue tape: the five hardest problems and the results we delivered

No die removal, no flipping: dark cracks, gold bumps, discoloration and broken frames inspected directly on blue tape. Four years and ten sample rounds, from 150 mil down to 5 mil.

Free Assessment

Free feasibility assessment

Send us the step on your line that is hardest to see clearly.

Send us photos of the part, defect samples and your throughput target. We run an optical imaging test first (lighting and camera selection), then tell you whether it can be done and how. The assessment is free.

  • Free imaging test
  • NDA available

Process

  1. 01Requirements review and sample imaging
  2. 02Optical validation and feasibility report
  3. 03Machine design, build and software development
  4. 04Factory acceptance, training and warranty

Direct

Write
Office / Fax
+886-3-516-5662　Fax +886-3-573-3281
Address
10F-1, No. 27, Puding Rd., East Dist., Hsinchu City 300, Taiwan
Business hours
Mon–Fri 9:00–18:00 (Taiwan time)

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